Semiconductor advanced packaging materials into the "stuck neck" new focus of domestic substitution into the offensive period of replication.

[February 1, 2026] Under the background that Moore's Law is approaching the physical limit, advanced packaging (Advanced Packaging) has become the key path to continue chip performance improvement, and the material system behind it-including temporary bonding adhesive, photosensitive polyimide (PSPI), underfill adhesive (Underfill), ABF carrier resin, etc.-is becoming the new strategic commanding height of the global semiconductor industry chain.

Since the period, the high-end packaging materials market by Japan JSR, Sumitomo Electric Wood, the United States DuPont and other enterprises monopoly, the localization rate of less than 10%. But that pattern is changing. In 2025, domestic enterprises such as Dinglong shares, Huahai Chengke, Anji Technology have announced PSPI, epoxy molding plastic (EMC), wafer grinding fluid and other products through TSMC, Changdian Technology and other head customer certification. Among them, Dinglong's KrF photoresist and supporting materials have been used in bulk in the RDL (re-routing layer) process in Chiplet packaging. "The package is the system, the material is the interface." Experts from the China Electronic Materials Industry Association pointed out that "new architectures such as Chiplet, 3D stacking and silicon optical integration put forward extreme requirements on the matching of thermal expansion coefficient, dielectric properties and cleanliness of materials, which is not only a challenge, but also an opportunity for domestic materials to change lanes and overtake." The third phase of the National Fund has recently clearly included "advanced packaging materials" in the key investment direction, and many places are also planning to build electronic chemicals industrial parks. The industry predicts that by 2027, China can achieve full autonomy in the field of low-end packaging materials, and the localization rate of high-end products is expected to exceed 30%.